Packed in 25kg,250kg plastic drums，IBC drum

 

CAS No :17439-11-1

Formula  : H₂TiF₆

Treated as metal surface 

- Electroplating: can enhance the bonding force between the plating layer and the substrate, make the surface of the plating more smooth and uniform, improve the plating quality, widely used in nickel plating, copper plating and other processes.

Electroless plating: In the process of electroless nickel plating, as an additive, it can improve the performance of the plating solution, improve the plating speed and the corrosion resistance and wear resistance of the coating.

- Passivation: used for metal passivation treatment, forming a dense passivation film on the metal surface to improve the corrosion resistance of the metal, such as the passivation of steel, aluminum and aluminum alloys.

 

Electronics industry

 

- Etching: In semiconductor manufacturing, it can be used to etch materials such as silicon wafers to accurately control the formation of circuit patterns, and is an important material for manufacturing integrated circuits.

- Cleaning: It can effectively remove oxides and impurities on the surface of electronic components, ensure the performance and reliability of electronic components, and is used in the cleaning process of electronic components production.

 

Ceramics and glass industry

 

- Ceramics: Added to ceramic glaze, can reduce the surface tension of the glaze, improve the gloss and hardness of the glaze, but also improve the sintering performance of the ceramic, reduce the sintering temperature.

- Glass: used for the surface treatment of glass, which can enhance the scratch resistance and chemical stability of glass, improve the quality and service life of glass, and can also be used as a glass etching agent for glass cutting, frosting and other processes.